港股詳情

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基本半導體

66.000

-1.350-2.00%

成交量：54.69萬

成交額：3,675.41萬

市值：200.64億

市盈率：-44.49

高：71.000

開：68.900

低：65.100

收：67.350

52周最高：71.000

52周最低：32.700

股本：3.04億

香港流通股本：2.88億

量比：1.24

換手率：0.19%

股息：- -

股息率：- -

每股收益(LYR):-1.483

淨資產收益率：-426.94%

總資產收益率：-20.67%

市淨率：1250.12

市盈率(LYR):-44.49

市銷率: 55.41

資料載入中...

總覽公司新聞資訊公告

港股異動 | 基本半導體(09971)午後升逾4% 再創上市新高公司上市後動作頻頻

港股異動 | 基本半導體(09971.HK)午後升逾4% 再創上市新高公司上市後動作頻頻

港股異動 | 基本半導體(09971)再升逾4% 與漢磊科技達成合作補齊8英寸SiC晶圓產能短板

基本半導體(09971.HK)建議採納H股股權激勵計劃

基本半導體(09971)擬推進H股全流通 1675.53萬股內資股計劃轉換上市

基本半導體(09971)擬推H股股權激勵計劃　上限約3042.90萬股並同步修訂章程

基本半導體（09971）將於2026年8月28日召開今年首場臨時股東大會

基本半導體(09971.HK)建議申請H股全流通

基本半導體(09971)建議申請H股全流通

基本半導體擬回購已發行股份不超過一成

基本半導體(09971)股價上升5.063%，現價港幣$58.1

阿斯达克财经

基本半導體(09971)出現大手賣出23.8萬股，成交價$48.33，涉資1.15千萬

阿斯达克财经

基本半導體(09971)股價上升8.197%，現價港幣$56.1

阿斯达克财经

基本半導體盤中升逾4% 公司已與漢磊科技達成戰略合作

智通港股早知道 | 美國擬禁止進口中國新型數據中心設備中方回應：停止抹黑與制裁威脅

基本半導體與漢磊科技達成戰略合作，加快8英寸碳化硅晶圓開發及量產

基本半導體(09971)已與漢磊科技達成戰略合作

基本半導體攜手Episil Technologies：加速SiC產品在新能源汽車與AI數據中心領域的佈局

基本半導體與Episil Technologies達成戰略合作框架協議

基本半導體（09971）與漢磊科技簽署戰略合作協議加速8英寸碳化硅晶圓量產

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1675.53萬股內資股計劃轉換上市","url":"https://stock-news.laohu8.com/highlight/detail?id=1191261819","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1191261819?lang=zh_tw&edition=fundamental","pubTime":"2026-08-11 22:55","pubTimestamp":1786460156,"startTime":"0","endTime":"0","summary":"深圳基本半导体股份有限公司8月11日发布公告称，公司董事会已审议并批准启动H股全流通申请，拟将16,755,283股未上市内资股转换为H股，占公司截至公告日已发行股份总数的5.51%。基本半导体提醒投资者，H股全流通及相关转换、上市仍需满足中国证监会、香港联交所及其他境内外监管机构的审批程序，敬请投资者审慎决策，注意投资风险。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1164629753","title":"基本半導體(09971)擬推H股股權激勵計劃　上限約3042.90萬股並同步修訂章程","url":"https://stock-news.laohu8.com/highlight/detail?id=1164629753","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1164629753?lang=zh_tw&edition=fundamental","pubTime":"2026-08-11 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22:55","pubTimestamp":1786460151,"startTime":"0","endTime":"0","summary":"深圳基本半导体股份有限公司8月11日公告，公司定于2026年8月28日14时30分在深圳市坪山区召开2026年第一次临时股东大会，审议5项特别决议案。为确定股东参会及表决资格，公司将于2026年8月25日至2026年8月28日暂停H股股份过户登记。2026年8月28日名列股东名册的H股及内资股股东有权出席并投票。H股股东如计划参会，须在2026年8月24日16时30分前将股份过户文件送交香港中央证券登记有限公司。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"conferences,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658991946","title":"基本半導體(09971.HK)建議申請H股全流通","url":"https://stock-news.laohu8.com/highlight/detail?id=2658991946","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2658991946?lang=zh_tw&edition=fundamental","pubTime":"2026-08-11 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发布公告，经考虑本公司H股于联交所主板上市后接获的股东意向及鉴于指引，董事会已于2026年8月11日审议并批准建议申请将1675.53万股未上市内资股转换为本公司H股。根据本公司的公司章程及中国适用法律，本公司毋须召开股东会以批准H股全流通。截至本公告日期，本公司尚未就H股全流通向中国证监会提交申请及备案文件，亦尚未向联交所申请转换及上市。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1478718.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK1163","09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1110663108","title":"基本半導體擬回購已發行股份不超過一成","url":"https://stock-news.laohu8.com/highlight/detail?id=1110663108","media":"公告速递","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1110663108?lang=zh_tw&edition=fundamental","pubTime":"2026-08-11 22:46","pubTimestamp":1786459565,"startTime":"0","endTime":"0","summary":"基本半导体公告显示，公司董事会建议授予一般性授权，拟在获得股东批准后，可于授权期间按不超过该公司已发行H股总数10%的额度回购股份。截至公告日，公司共发行304,289,725股股份，其中287,534,442股为H股。公司计划于2026年8月28日（星期五）召开临时股东大会审议该项回购议案，届时自8月25日至28日将暂停办理H股过户登记。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"基本半导体拟回购已发行股份不超过一成","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2657917526","title":"基本半導體(09971)股價上升5.063%，現價港幣$58.1","url":"https://stock-news.laohu8.com/highlight/detail?id=2657917526","media":"阿斯达克财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2657917526?lang=zh_tw&edition=fundamental","pubTime":"2026-08-07 13:50","pubTimestamp":1786081800,"startTime":"0","endTime":"0","summary":"[上升股]基本半导体(09971) 股价在下午01:50比前收市价上升5.063%，现股价为港币$58.1。至目前为止，今日最高价为$58.1，而最低价为$48.3。总成交量为42.49万股，总成交金额为港币$2.287千万。","market":"sh","thumbnail":"https://plib.aastocks.com/aafnnews/image/medialib/20180205152552334_s.jpg","type":0,"news_type":0,"thumbnails":["https://plib.aastocks.com/aafnnews/image/medialib/20180205152552334_s.jpg"],"rights":{"source":"aastocks_highlight","url":"http://www.aastocks.com/tc/stocks/news/aamm-content/AAR2608071956/aamm-all-category","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.aastocks.com/tc/stocks/news/aamm-content/AAR2608071956/aamm-all-category","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"aastocks_highlight","symbols":["BK1163","09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2657685240","title":"基本半導體(09971)出現大手賣出23.8萬股，成交價$48.33，涉資1.15千萬","url":"https://stock-news.laohu8.com/highlight/detail?id=2657685240","media":"阿斯达克财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2657685240?lang=zh_tw&edition=fundamental","pubTime":"2026-08-06 16:01","pubTimestamp":1786003260,"startTime":"0","endTime":"0","summary":"[大手成交]基本半导体(09971)在下午04:01出现大手卖出，成交量为23.8万，成交价为港币$48.33，涉资1.15千万。至目前为止，股价升3.631%，今日最高价为$56.1，而最低价为$48.33，总成交量为64.24万股，总成交金额港币$3.342千万。","market":"sh","thumbnail":"https://plib.aastocks.com/aafnnews/image/medialib/20180205145549237_s.jpg","type":0,"news_type":0,"thumbnails":["https://plib.aastocks.com/aafnnews/image/medialib/20180205145549237_s.jpg"],"rights":{"source":"aastocks_highlight","url":"http://www.aastocks.com/tc/stocks/news/aamm-content/AAT2608066777/aamm-all-category","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.aastocks.com/tc/stocks/news/aamm-content/AAT2608066777/aamm-all-category","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"aastocks_highlight","symbols":["BK1163","09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2657551622","title":"基本半導體(09971)股價上升8.197%，現價港幣$56.1","url":"https://stock-news.laohu8.com/highlight/detail?id=2657551622","media":"阿斯达克财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2657551622?lang=zh_tw&edition=fundamental","pubTime":"2026-08-05 15:14","pubTimestamp":1785914040,"startTime":"0","endTime":"0","summary":"[上升股]基本半导体(09971) 股价在下午03:14比前收市价上升8.197%，现股价为港币$56.1。至目前为止，今日最高价为$56.1，而最低价为$51.85。总成交量为27.3万股，总成交金额为港币$1.477千万。","market":"fut","thumbnail":"https://plib.aastocks.com/aafnnews/image/medialib/20190515141040914_s.png","type":0,"news_type":0,"thumbnails":["https://plib.aastocks.com/aafnnews/image/medialib/20190515141040914_s.png"],"rights":{"source":"aastocks_highlight","url":"http://www.aastocks.com/tc/stocks/news/aamm-content/AAR2608053632/aamm-all-category","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.aastocks.com/tc/stocks/news/aamm-content/AAR2608053632/aamm-all-category","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"aastocks_highlight","symbols":["09971","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2657997185","title":"基本半導體盤中升逾4% 公司已與漢磊科技達成戰略合作","url":"https://stock-news.laohu8.com/highlight/detail?id=2657997185","media":"新浪港股","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2657997185?lang=zh_tw&edition=fundamental","pubTime":"2026-08-05 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中方回應：停止抹黑與制裁威脅","url":"https://stock-news.laohu8.com/highlight/detail?id=2657593918","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2657593918?lang=zh_tw&edition=fundamental","pubTime":"2026-08-05 07:15","pubTimestamp":1785885348,"startTime":"0","endTime":"0","summary":"美国拟禁止进口中国新型数据中心设备 我使馆：敦促美停止抹黑中企并威胁制裁据媒体4日报道，知情人士透露，美国政府正起草一项禁令，拟禁止进口中国新型号的数据中心组件，以保护支撑人工智能发展的关键基础设施。对此，中国驻美国大使馆回应称，北京敦促美国“倾听两国工商界客观、理性的声音”，停止抹黑中国企业并以制裁相威胁。中金称，光模块的核心功能是光电信号转换，本身不承担业务数据存储。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1476057.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK1163","SG9999002950.SGD","LU1166156734.SGD","AIFD","02715","BK1142","LU0702159343.USD","BK4588","09971","BK1096","BK1183","AIO","DTCR","HK0000252160.HKD","BK1551","CLOU","HK0000252152.HKD","BLOK","SKYY","WOOD","WPAI","WDAI","BK1514","BK1172","WISE","BK4585","FCLD","SG9999001093.SGD","HK0000500386.USD","BK1557","VXUS","BK1114","01128","BK1589","KCAI","00751","02689","CLDL","LU0702159699.USD","PBOT","FMET","HPEL","IDGT","AIBU","02420","BK1223","SG9999014674.SGD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2656325705","title":"基本半導體與漢磊科技達成戰略合作，加快8英寸碳化硅晶圓開發及量產","url":"https://stock-news.laohu8.com/highlight/detail?id=2656325705","media":"财中社","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2656325705?lang=zh_tw&edition=fundamental","pubTime":"2026-08-04 18:17","pubTimestamp":1785838620,"startTime":"0","endTime":"0","summary":"8月4日，基本半导体（09971）发布公告，公司已与汉磊科技股份有限公司达成战略合作。此次战略合作，双方将在之前长期合作的基础上，加快8英寸碳化硅晶圆的开发及量产。基于公司半导体的先进产品技术和市场优势以及汉磊科技高质量大规模晶圆制造能力，共同推进新工艺平台开发和量产落地，提升碳化硅产品在新能源汽车、AI算力中心等领域的市场份额。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202608043831315543.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202608043831315543.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["STHH","09971","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2656053478","title":"基本半導體(09971)已與漢磊科技達成戰略合作","url":"https://stock-news.laohu8.com/highlight/detail?id=2656053478","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2656053478?lang=zh_tw&edition=fundamental","pubTime":"2026-08-04 18:12","pubTimestamp":1785838340,"startTime":"0","endTime":"0","summary":"此次战略合作，双方将在之前长期合作的基础上，加快8英寸碳化硅晶圆的开发及量产。基于基本半导体的先进产品技术和市场优势以及汉磊科技高质量大规模晶圆制造能力，共同推进新工艺平台开发和量产落地，提升碳化硅产品在新能源汽车、AI算力中心等领域的市场份额。本公司董事会认为此次战略合作有望在未来几年为本公司提供先进及充足的8英寸碳化硅晶圆制造能力，有利于合作双方在市场开拓及技术迭代方面实现重大突破。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1475842.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["09971","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1155361578","title":"基本半導體攜手Episil 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Technologies展开合作，旨在扩大其碳化硅（SiC）产品在新能源汽车与人工智能数据中心这两大高速增长市场中的渗透。随着电动汽车对高效能功率器件的需求激增，以及AI计算中心对能源效率的极致追求，SiC技术正成为关键的解决方案。双方将协同研发，提升相关产品的产能与性能，以满足不断增长的行业需求。此次合作不仅强化了供应链的稳定性，也预示着在绿色能源和智能计算双重驱动下，半导体材料革新的新篇章已然开启。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1177362147","title":"基本半導體與Episil Technologies達成戰略合作框架協議","url":"https://stock-news.laohu8.com/highlight/detail?id=1177362147","media":"美股速递","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1177362147?lang=zh_tw&edition=fundamental","pubTime":"2026-08-04 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Technologies正式签署战略合作协议。此举标志着双方将在半导体领域展开深度协同，共同探索技术前沿与市场机遇。该协议旨在整合各自优势资源，推动产业链上下游的紧密协作。通过此举，双方期望能加速产品创新进程，并提升在全球市场中的竞争力。此次战略结盟，不仅为两家公司注入了新的发展动能，也预示着行业合作模式的新尝试。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK1163","09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1125324740","title":"基本半導體（09971）與漢磊科技簽署戰略合作協議加速8英寸碳化硅晶圓量產","url":"https://stock-news.laohu8.com/highlight/detail?id=1125324740","media":"公告速递","labels":["corporation","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1125324740?lang=zh_tw&edition=fundamental","pubTime":"2026-08-04 18:10","pubTimestamp":1785838238,"startTime":"0","endTime":"0","summary":"2026年8月4日，基本半导体股份有限公司发布自愿公告称，公司已与台湾上市公司汉磊科技股份有限公司达成战略合作协议。双方将在既有长期合作基础上，加速8英寸碳化硅晶圆的开发与量产。基本半导体董事会表示，此次战略合作有望在未来几年内为公司提供先进且充足的8英寸碳化硅晶圆制造能力，有利于双方在市场拓展和技术迭代方面实现突破。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":5,"pageCount":1,"totalSize":93,"code":"91000000","status":"200"}]}}