Synopsys and TSMC Expand Collaboration to Accelerate AI and Multi-Die Chip Innovation on Advanced Process Technologies

Reuters

Sep 25

Synopsys and TSMC Expand Collaboration to Accelerate AI and Multi-Die Chip Innovation on Advanced Process Technologies

Synopsys Inc. has announced an expanded collaboration with TSMC to advance AI chip and multi-die design through a suite of EDA and IP solutions optimized for TSMC's cutting-edge semiconductor processes, including N2 and N2P. The partnership leverages Synopsys' 3DIC Compiler platform and industry-leading IP portfolio, enabling customers to achieve faster tape-outs and reduced integration risks for next-generation silicon. The collaboration also supports the latest high-performance standards and advanced 3D packaging technologies, positioning both companies at the forefront of innovation in AI, automotive, IoT, and high-performance computing applications.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Synopsys Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: SF82362) on September 24, 2025, and is solely responsible for the information contained therein.

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

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ID: SF82362) on September 24, 2025, and is solely responsible for the information contained therein.</span></em>\n</div></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1989764748.USD","symbol_name":"东方汇理环球颠覆性机遇A2 Acc","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20250924:nNDL7vQwNn:1","article_id":"2570080894","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2570080894","pubTimestamp":1758744025,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"Synopsys Inc. has announced an expanded collaboration with TSMC to advance AI chip and multi-die design through a suite of EDA and IP solutions optimized for TSMC's cutting-edge semiconductor processes, including N2 and N2P. 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The partnership leverages Synopsys' 3DIC Compiler platform and industry-leading IP portfolio, enabling customers to achieve faster tape-outs and reduced integration risks for next-generation silicon. The collaboration also supports the latest high-performance standards and advanced 3D packaging technologies, positioning both companies at the forefront of innovation in AI, automotive, IoT, and high-performance computing applications.\n      \n\nDisclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Synopsys Inc. published the original content used to generate this news brief via PR Newswire (Ref. 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