Ushio Inc. Joins Forces with Applied Materials in JOINT3 Consortium for Next-Gen Semiconductor Packaging Development
Reuters
Sep 03
<a href="https://laohu8.com/S/UHOIF">Ushio Inc.</a> Joins Forces with <a href="https://laohu8.com/S/AMAT">Applied</a> Materials in JOINT3 Consortium for Next-Gen Semiconductor Packaging Development
Ushio Inc. has joined the "JOINT3" consortium, a collaborative initiative aimed at advancing next-generation semiconductor packaging. This partnership, spearheaded by Resonac Corporation, seeks to accelerate the development of materials, equipment, and design tools optimized for panel-level organic interposers. Through this collaboration, which includes 27 global leaders in the semiconductor supply chain, Ushio will leverage its expertise in digital lithography technology to tackle challenges in the manufacturing processes of advanced package substrates. By participating in JOINT3, Ushio is committed to contributing to technological advancements and the realization of a more comfortable and convenient society through its innovative use of light.
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