SmartKem Inc. has announced a new collaboration with Manz Asia, focusing on advancing computer and AI chip packaging solutions. The partnership will feature the demonstration of SmartKem's inkjet printable dielectric layers at SEMICON® SEA 2025 in Singapore. This collaboration leverages Manz Asia's high-precision inkjet printing equipment, which supports a variety of substrates, to create scalable and sustainable semiconductor packaging solutions. The partnership aims to capitalize on the growing demand for advanced packaging in the AI sector, with panel-level packaging poised to significantly enhance throughput and reduce costs. This market is projected to grow to $600 million by 2030.
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