Shenzhen's Strategic Move in AI Computing: A Three-Year Plan to Become a Global Hub for AI Server Manufacturing

Deep News
Mar 24

Amid the global surge in artificial intelligence, computing power has become the core engine driving the growth of the digital economy. On March 23, the Shenzhen Municipal Industry and Information Technology Bureau officially released the "Shenzhen Action Plan for Accelerating High-Quality Development of the AI Server Industry Chain (2026-2028)". This document represents an upgrade to Shenzhen's "20+8" industrial cluster strategy, signaling the city's ambition to become a research, development, and manufacturing hub for ultra-large-scale intelligent computing clusters. It aims to provide solid support for Shenzhen's goal of becoming a globally leading center for advanced manufacturing and a hub for industrial technology innovation with significant international influence.

The plan's core logic revolves around a "full-chain" and "high-precision" approach. Facing intense competition in the global AI server market, Shenzhen is not opting for isolated breakthroughs. Instead, building on its existing foundation in the new-generation electronic information industry, it is conducting a comprehensive review and restructuring of the entire industrial chain. The plan precisely targets eight key areas, from underlying chips to final system integration, aiming to unblock critical pathways for industrial development.

In the core areas of computing power and storage, achieving self-sufficiency and control is the top priority. The policy explicitly supports the iterative application of domestically produced GPUs, NPUs, CPUs, and DPUs. It also takes a forward-looking stance by planning for the development of high-performance computing chips based on the RISC-V architecture, seeking to gain an early advantage in the era of heterogeneous computing. Simultaneously, addressing the extreme demands for data storage posed by large model training, Shenzhen will focus on breakthroughs in enterprise-grade SSDs, near-memory packaging, and computing-in-memory technologies, building a high-end storage supply system suitable for advanced algorithms.

As a major global manufacturing hub for printed circuit boards, the city has set even higher advancement goals in this plan. Leveraging existing advantages, the industry will transition towards 6-layer and above ultra-high-density interconnect boards, Ajinomoto Build-up Film substrates, and advanced packaging substrates. It will also promote the large-scale application of high-end base materials with low dielectric constants to support higher-frequency signal transmission.

Regarding optical communication, the critical "artery" for data transmission, Shenzhen has set a target: to drive the iterative upgrade of optical modules from the mainstream 800G to 1.6T and even 3.2T. Key breakthroughs will be pursued in silicon photonics modules, CPO/LPO/NPO packaged optical modules, and core optical chip materials, ensuring efficient throughput for massive data flows.

Furthermore, addressing the energy consumption and heat dissipation challenges associated with high computing power, the plan offers solutions with distinct Shenzhen characteristics. Capitalizing on the city's leading advantages in the new energy sector, the policy encourages the development of 800V high-voltage direct current power supplies and next-generation HVDC power supply solutions. It also innovatively proposes creating benchmark demonstrations for zero-carbon data centers utilizing "photovoltaics/offshore wind power + energy storage + direct green power connection." In cooling technology, beyond consolidating its leading position in cold plate liquid cooling, the city will accelerate the development of cutting-edge technologies like immersion cooling and chip-level direct cooling, aiming to completely resolve the thermal management bottlenecks of high-density computing power.

Coupled with breakthroughs in precision passive components like high-speed connectors and high-current power inductors, and the cultivation of complete system brands such as all-liquid-cooled AI super nodes and integrated large-model training-and-inference appliances, Shenzhen is weaving a tight and robust industrial protection network.

Breakthroughs in hardware are inseparable from a supportive ecosystem. Another highlight of the plan is its focus not only on product manufacturing but also on building a synergistic industrial ecosystem with integrated hardware and software and complete essential factors. Shenzhen recognizes that only through institutional innovation can scattered industrial resources be consolidated into a powerful collective force.

In terms of spatial and project layout, Shenzhen will strengthen coordination between municipal and district levels, fully utilizing the "industrial upward" model to quickly provide space for lightweight manufacturing, R&D, and pilot production projects. More notably, the "chain leader poses challenges, upstream/downstream partners provide solutions" collaborative innovation model aims to break down barriers between industry, academia, and research. Leading companies will identify practical technical challenges, guiding small and medium-sized enterprises and research institutions in the supply chain to make targeted breakthroughs. Policies like support for the first set of equipment will accelerate the large-scale application of domestic equipment and materials, forming a virtuous cycle where large companies drive small ones and small companies, in turn, stimulate large ones.

Supply chain security and resilience are also key considerations of this policy. Leveraging the International Trading Center for Electronic Components and Integrated Circuits, Shenzhen will build a transparent and efficient supply chain guarantee system and implement chain-based investment attraction to bring upstream core material and component enterprises to the city.

Regarding hardware-software integration, the policy encourages regular cooperation mechanisms between leading supply chain companies, cloud service providers, and large model firms. It supports the deep adaptation of OpenHarmony and openEuler operating systems with the RISC-V architecture, thereby building a fully self-sufficient and controllable domestic computing power ecosystem.

Furthermore, financial resources and talent are seen as the dual engines for industrial development. The plan proposes optimizing full-cycle investment and financing services, strengthening support for SMEs, with a particular focus on early/mid-stage and startup companies in the industrial chain. It aims to direct government investment funds towards high-quality projects within the AI server industry chain, providing ample "ammunition" for technological innovation. Concurrently, by deepening industry-education integration, expanding enrollment in relevant academic programs, and attracting specialized technical talent to develop their careers in Shenzhen, the city is building a reservoir of intellectual resources for the industry's long-term growth.

As these policies take root, Shenzhen is poised to secure a more central strategic position in the global AI server industry chain within the next three years, potentially setting a new benchmark for the self-sufficiency and high-quality development of the artificial intelligence industry both in China and globally.

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10