1. Record High Performance: In Q3 2025, revenues reached NT$989.92 billion, up from NT$759.692 billion in the same period last year. Q3 net profit hit NT$452.3 billion, marking a new company record with a year-on-year growth of 39%.
2. Outlook Exceeds Expectations: The projected sales for Q4 are between $32.2 billion and $33.4 billion, surpassing the market expectation of $31.23 billion. The expected gross margin for Q4 is between 59% and 61% (compared to 59.5% in Q3). For 2025, capital expenditures are anticipated to be between $40 billion and $42 billion, revised from a prior forecast of $38 billion to $42 billion.
3. Advanced Processes Dominate: Shipments of the 3-nanometer process accounted for 23% of Taiwan Semiconductor Manufacturing's wafer sales in Q3 2025, while 5-nanometer process shipments made up 37%. Additionally, 7-nanometer sales represented 14% of total wafer sales. Overall, revenue from advanced processes (including 7-nanometer and more advanced technologies) constituted 74% of total wafer sales for the quarter.
4. Timely Advancement of Processes: The 2-nanometer process is set to commence mass production later this quarter, with the A16 process expected to achieve mass production in the second half of next year. Efforts continue to enhance Cowos capacity by 2026, which is an advanced semiconductor packaging technology used for integrating multiple chips onto a single substrate, widely applied in high-performance computing and artificial intelligence fields.
5. Confidence Amid Risks: The development of the AI market is very promising, with strong demand for AI expected to persist; confidence in this major trend is growing. However, there are risks associated with potential impacts from tariffs. Caution will be maintained while formulating the 2026 business plan. Currently, the production capacity for both upstream and downstream segments of AI chips is extremely tight, and the company is working diligently to expand supply, anticipating that AI-related capacity will continue to struggle to meet demand ahead of 2026.
6. Aggressive Global Expansion: ① The company continues to accelerate capacity expansion in Arizona, with plans to acquire a second large piece of land to support expansion efforts; ② In Japan, the construction of a second wafer factory has commenced; ③ Progress in Germany is proceeding smoothly; ④ In Taiwan, multiple phases of 2-nanometer wafer factory construction are being prepared.