HTSC (06886): "24HTSC S6" Bond to Pay Interest on August 25
Stock News
Aug 18
HTSC (06886) announced that the company's 2024 short-term corporate bonds issued to professional investors (4th issue), referred to as "the current bonds," will begin paying interest accrued from December 24, 2024 to August 23, 2025, along with the principal of the current bonds, starting August 25, 2025.
The current bonds are abbreviated as "24HTSC S6" with a total issuance amount of RMB 3 billion and a coupon rate of 1.67%. Each unit of the current bonds will redeem a principal amount of RMB 1,000, with an interest payment of RMB 11.118 per unit (including tax).
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.