Upon the impressive display of a 90GHz ultra-high-speed real-time oscilloscope and the collaborative design interface of Qiyunfang's Electronic Design Automation (EDA) software, the recently concluded 2025 Bay Area Semiconductor Industry Ecological Expo in Shenzhen has transcended mere product showcasing. The event vividly illustrated the "full of vitality and resilience" landscape of China's semiconductor industry, marking a significant transition from isolated breakthroughs to systematic advancements. These technological innovations are poised to enhance industry resilience and potentially reshape the global industrial landscape.
The core value of these breakthroughs lies in their strategic initiative to overcome the "bottleneck" problems. For a long time, EDA software and high-end testing equipment have been seen as the "left and right brain" of the semiconductor sector, yet they have been firmly controlled by Western companies. At this expo, Qiyunfang unveiled two EDA software products with independent intellectual property rights, filling the technological void in domestic high-end electronic design software. These products have achieved first-class industry performance, significantly reducing hardware product development cycles by up to 40% and increasing design success rates by 30%, thereby greatly enhancing development efficiency and quality. The introduction of the Wanlian 90GHz ultra-high-speed oscilloscope is particularly monumental; known as the "Chinese ruler," this device has elevated the bandwidth of domestic oscilloscopes from a previous cap of 20GHz to an internationally advanced level, directly addressing testing bottlenecks in cutting-edge areas such as 6G communications and intelligent driving. These breakthroughs not only fill technological gaps but also establish the "first line of defense" for industry security, transitioning from "unable to measure" to "precise measurement" and from "dependence on imports" to "replacement and surpassing."
The profound impact of these breakthroughs is reflected in the activation of collaborative resonance across the entire industry chain. The complexity of the semiconductor industry makes it difficult for isolated innovations to generate competitiveness. However, the Bay Area Expo clearly showcased the Chinese path of collaborative iteration involving "equipment-material-software." The displays from Xinkailai featured 16 models in the "Mingshan" series that complement their subsidiaries' EDA and testing products. Zhuojing Technology's wafer-to-wafer hybrid bonding equipment for 3D memory chip manufacturing has begun supplying leading production lines in bulk. The high-purity metal sputtering targets from Yuyuan Yijin meet advanced process requirements for integrated circuits. This positive cycle of "upstream breakthroughs - midstream verification - downstream applications" exemplifies the construction of capabilities across the entire chain. Moreover, noteworthy advancements in ecological collaboration emerged: the compatibilities between Xintong's GPU and Longxin's CPU, a cooperative exhibition of a 12-inch equipment combination by Northern Huachuang and Xinyuanwei, and nearly 30 organizations jointly establishing a "Chiplet and Advanced Packaging Ecology Zone" reflect a transition from "passive adaptation" to "active engagement," allowing every link in the supply chain to participate in innovation and inject substantial momentum into industry resilience.
The long-term value of these technological breakthroughs lies in reconstructing the ecological foundation for industrial development. The sustainable growth of the semiconductor industry hinges on the support of funding, markets, and talent, and the Bay Area Expo has aptly created a platform for resource aggregation. The establishment of a 5 billion Yuan industrial fund in Shenzhen targets critical areas and weak links within the industry chain. In the first half of 2025, the R&D investment intensity for equipment manufacturing firms in the Sci-Tech Innovation Board reached 16.3%, with a total of over 4,000 patents accumulated, reflecting capital's patience and confidence in hard technology. Market feedback has been equally positive: the expo attracted 5,000 top enterprise buyers, and the strong demand from end manufacturers like BYD and DJI has provided a "testing ground" for new technologies, forming a positive cycle of "innovation-application-iteration." Moreover, the construction of an open ecological system is noteworthy—well-known foreign enterprises such as Applied Materials from the U.S., Tokyo Electron from Japan, and Merck from Germany attended the expo, as did NXP and Micron, which intensified their investments in China, proving that the Chinese market is both fertile ground for autonomous innovations and a stage for global collaborations. This "independent yet open" development model enables Chinese chips to find the optimal balance between security and openness.
Standing at the crossroads of global semiconductor industrial restructuring, the technological breakthroughs showcased at the Bay Area Expo shine like a beacon, illuminating China's path to progress. From the "pen" of EDA software to the "ruler" of oscilloscopes, and from isolated innovations to full-chain collaboration, these shifts all confirm a critical fact: China's semiconductor industry has bid farewell to the struggle for isolated breakthroughs and entered a new phase of "systematic strengthening."
Though there remains a gap compared to leading international standards, the impressive statistics showing Shenzhen's semiconductor and integrated circuit industry reaching a scale of 256.4 billion Yuan in 2024, coupled with the doubling of growth in segmented fields and the focused expressions captured during the expo, all convey the belief that "step by step, we reach thousands of miles." The future is here; with China's "ruler" measuring technological heights and a collaborative ecosystem strengthening the industrial foundation, Chinese chips are set to write a new chapter of resilience and vitality under the dual engines of independent innovation and open collaboration.