美股详情

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GLOBALFOUNDRIES Inc.

39.80

+0.25000.63%

盘后：40.030.2265+0.57%16:48 EDT

成交量：142.78万

成交额：5,683.47万

市值：220.86亿

市盈率：-117.02

高：40.17

开：39.61

低：39.30

收：39.55

数据加载中...

总览公司新闻资讯公告

AMD借助AI初创公司完善芯片与软件设计

环球市场播报

德国零售巨头“三店连开”拓展中国长三角市场

AMD首款符合Ultra Ethernet规范400GbE网卡进入部署阶段

三星存储：一个坏消息，一个好消息

半导体芯闻

AMD 下代 AI 机架解决方案“长胖”：Helios 采用双宽机架设计

AMD 强调 UALink 高速互联优势：更多节点，开放硬件组合

外媒：人工智能数据中心建设商Crusoe计划从AMD购买约4亿美元AI芯片

AMD确认MI350X AI芯片将采用三星/美光HBM3E

AM4平台“还能舞”：锐龙5 5500X3D处理器现已上线

爆料称 AMD Zen 7 架构桌面处理器核心数达 32，较 Zen 5 旗舰翻倍

笔吧评测室

半导体巨头，重塑供应链

半导体行业观察

外盘头条：特朗普称担忧中东局势并施压鲍威尔 AMD发布新一代AI芯片减税法案真降赤字？还是加剧贫富差距

环球市场播报

AMD CEO：2028年AI芯片市场规模将超5000亿美元

AMD首席执行官苏姿丰：我们正在各个领域持续努力，并在美国增加更多的制造产能。

超微凭借AMD Instinct™ MI350系列GPU和平台，推出性能与效率优化的液冷及风冷人工智能解决方案。

AMD 发布下一代开源软件栈技术 ROCm 7

【甲骨文：将在其云服务中提供多达13.1万个AMD的MI355X芯片集群】甲骨文：将在其云服务中提供多达13.1万个AMD的MI355X芯片集群。

Meta公司高管：正在使用AMD的MI350芯片进行推荐引擎的训练和部署。

AMD GFX1250“CDNA”GPU 架构曝光，预计用于 MI400 系列

AMD首席执行官苏姿丰：公司在过去一年里对人工智能相关企业进行了25项战略投资。

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强调 UALink 高速互联优势：更多节点，开放硬件组合","url":"https://stock-news.laohu8.com/highlight/detail?id=2543791365","media":"市场资讯","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2543791365?lang=zh_cn&edition=fundamental","pubTime":"2025-06-13 12:13","pubTimestamp":1749787980,"startTime":"0","endTime":"0","summary":"IT之家 6 月 13 日消息，在 UALink 联盟 4 月推出 UALink 200G 1.0 加速器高速互联规范后，英伟达宣布了 NVLink Fusion IP 授权作为回应。而在北京时间今日凌晨的 Advancing AI 2025 大会上，AMD 作为 UALink 联盟的主推者之一展开了新一轮的宣传战。AMD 以三个 \"Any\" 强调了 UALink 的开放性优势：该互联支持任意的 CPU、加速器和交换芯片，而 NVLink Fusion 意味着兼容设备仍与英伟达的生态系统密切绑定。AMD 表示 UALink 拥有完整的互联技术堆栈，在性能和可扩展性两方面同样出色。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/t/2025-06-13/doc-inezxarn6605457.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["BK4573","LU0056508442.USD","BK4614","IE00B5949003.HKD","LU1803068979.SGD","BK4529","AMD","BK4566","LU0823434740.USD","BK4588","LU2458330243.SGD","LU0109392836.USD","LU0823421416.USD","BK4532","LU0719512351.SGD","LU0127658192.USD","LU1989764664.SGD","IE0009356076.USD","LU2250418816.HKD","LU1951200564.SGD","LU0823421333.USD","LU0198837287.USD","LU0979878070.USD","LU1880398471.USD","LU1064131342.USD","LU0082616367.USD","LU1242518857.USD","GFS","LU2458330169.SGD","IE00BMPRXR70.SGD","LU1242518931.SGD","LU1303367103.USD","LU0823434583.USD","IE0004445239.USD","LU0889565833.HKD","BK4554","LU0642271901.SGD","BK4141","LU1852331112.SGD","LU2264538146.SGD","BK4534","LU1951198990.SGD","BK4543","LU1923623000.USD","LU1988902786.USD","BK4612","LU1880398554.USD","BK4575","LU1316542783.SGD","LU2360106780.USD"],"gpt_icon":0},{"id":"2543575241","title":"外媒：人工智能数据中心建设商Crusoe计划从AMD购买约4亿美元AI芯片","url":"https://stock-news.laohu8.com/highlight/detail?id=2543575241","media":"市场资讯","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2543575241?lang=zh_cn&edition=fundamental","pubTime":"2025-06-13 11:25","pubTimestamp":1749785100,"startTime":"0","endTime":"0","summary":"来源：环球网据路透社报道，Crusoe公司首席执行官Chase Lochmiller表示，这家人工智能数据中心建设商计划从超威半导体公司 购买价值约4亿美元的AI芯片，以增加其计算能力组合。Crusoe计划购买约1.3万颗MI355X芯片，并采用液体冷却系统。值得一提的是，Crusoe计划购买的AMD MI355X芯片包含大量高带宽内存，这使得它们非常适合运行人工智能应用程序，也就是所谓的推理。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"96f23472cf29d9ae177cfca10f5cad38","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/t/2025-06-13/doc-inezwwii7384992.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["BK4585","LU0823421333.USD","LU0198837287.USD","LU2264538146.SGD","IE0009356076.USD","BK4573","IE00B5949003.HKD","LU1951198990.SGD","BK4614","LU1852331112.SGD","LU1803068979.SGD","BK4566","161631","LU1880398471.USD","LU1242518857.USD","LU0081259029.USD","IE00BMPRXR70.SGD","LU0082616367.USD","LU1316542783.SGD","BK4588","LU0109392836.USD","LU2360106780.USD","AMD","BK4605","LU0390134368.USD","BK4141","LU0889565833.HKD","LU0056508442.USD","BK4612","BK4529","LU1303367103.USD","LU1064131342.USD","BK4512","LU1923623000.USD","LU2458330243.SGD","LU1242518931.SGD","LU0823434740.USD","LU0823434583.USD","IE0004445239.USD","LU1951200564.SGD","IE00BMPRXN33.USD","LU0642271901.SGD","BK4554","LU0719512351.SGD","LU0823421416.USD","LU0979878070.USD","LU1989764664.SGD","GFS","LU1988902786.USD"],"gpt_icon":0},{"id":"2543757351","title":"AMD确认MI350X AI芯片将采用三星/美光HBM3E","url":"https://stock-news.laohu8.com/highlight/detail?id=2543757351","media":"爱集微","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2543757351?lang=zh_cn&edition=fundamental","pubTime":"2025-06-13 10:49","pubTimestamp":1749782944,"startTime":"0","endTime":"0","summary":"6月12日，在圣何塞会议中心举行的AI Advancing 2025大会上，AMD宣布其新款AI加速器MI350X和MI355X将搭载三星和美光的12层HBM3E芯片。虽然此前三星电子一直在向AMD供应HBM，但这是AMD首次正式确认。上一代MI300X为192GB，而MI325X为256GB。预计这将需要三星HBM进行大规模供应。AMD表示，将于明年推出的MI400系列将为每个GPU配备432GB的HBM4显存。据市场调研公司Omdia数据，今年第一季度，SK海力士占据全球DRAM市场的36.9%，三星电子紧随其后，市场份额为34.4%，美光则为25%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250613104952977d88dc&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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5500X3D处理器现已上线","url":"https://stock-news.laohu8.com/highlight/detail?id=2543277625","media":"IT之家","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2543277625?lang=zh_cn&edition=fundamental","pubTime":"2025-06-13 10:02","pubTimestamp":1749780141,"startTime":"0","endTime":"0","summary":"核心与线程。加速频率。基准频率。L3 缓存。默认 TDP. 6 核 12 线程。4 GHz. 3 GHz. 96 MB. 105 W. 5600X3D. 6 核 12 线程。4.4 GHz. 3.3 GHz. 96 MB. 105 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AMD Zen 7 架构桌面处理器核心数达 32，较 Zen 5 旗舰翻倍","url":"https://stock-news.laohu8.com/highlight/detail?id=2543203945","media":"笔吧评测室","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2543203945?lang=zh_cn&edition=fundamental","pubTime":"2025-06-13 10:00","pubTimestamp":1749780011,"startTime":"0","endTime":"0","summary":"本文转自：IT之家作者：准泽今日爆料消息显示，AMD Zen 7 架构旗舰消费级桌面处理器的核心数量将大幅增加，有望达目前 Zen 5 架构旗舰处理器 R9 9950X 的两倍。据透露，Zen 7 架构桌面处理器将有“经典”和“3D”两种变体，前者将采用双 16 核 CCD 设计，核心总数高达 32，线程数量将达到惊人的 64；后者则可能不会出现在消费级 Zen 7 处理器上。作为对比，目前 Zen 5 架构旗舰处理器 R9 9950X 为 16 核 32 线程设计。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250613100459a7066c12&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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AMD发布新一代AI芯片 减税法案真降赤字？还是加剧贫富差距","url":"https://stock-news.laohu8.com/highlight/detail?id=2543628528","media":"环球市场播报","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2543628528?lang=zh_cn&edition=fundamental","pubTime":"2025-06-13 06:00","pubTimestamp":1749765600,"startTime":"0","endTime":"0","summary":"　　美国总统唐纳德·特朗普称，以色列“很可能”会对伊朗实施军事打击，但他反对在谈判进行期间发动进攻。　　特朗普近日表示，他对美国与伊朗达成核协议的信心已减弱。特朗普还威胁称，美国可能会在无法达成协议的情况下诉诸武力。　　美国总统唐纳德特朗普周四将矛头对准美联储主席杰罗姆鲍威尔，称其为 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