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Columbia Select Technology ETF

28.36

-0.0462-0.16%

盘后：28.390.0299+0.11%16:04 EDT

成交量：5,874.00

成交额：16.60万

市值：2,552.41万

市盈率：- -

高：28.39

开：28.37

低：28.09

收：28.41

数据加载中...

总览公司新闻公告

SEMI 3DIC先进封装制造联盟将成军

研报掘金丨东方证券：首予盛美上海“买入”评级，目标价136.08元

全球半导体业面临百万人才缺口 SEMI预警2030年技术人力严重短缺

【扩张】SEMI:AI驱动产业加速扩张,2028年半导体产能将达到每月1110万片晶圆；英伟达市值有望达6万亿美元

SEMI-e暨创新展、集成电路制造年会同框而行

半导体巨头，重塑供应链

半导体行业观察

一手硬科技、一手高成长！震荡市低吸这两条主线躺赢

【焦点】AI驱动 Q1半导体资本支出同比增长27%；

SEMI主席：量子计算有望推动半导体市场 2040年或翻倍至2万亿美元

市场消息：特斯拉计划本月底开始从中国运输用于在美国生产CYBERCAB和SEMI卡车的零部件。

超4600只个股上涨，连续5个交易日逾百股涨停！近20家公司表示助力外贸企业拓宽渠道，这个板块掀涨停潮

每日经济新闻

【光刻机概念午后活跃高盟新材涨超10%】午后高盟新材涨超10%，此前格林达涨停，飞凯材料、茂莱光学、波长光电、西陇科学、华特气体等涨幅靠前。消息面上，国际半导体产业协会（SEMI）最新发布的数据显示，2024年全球半导体制造设备出货金额达到1171亿美元，较2023年的1063亿美元增长10%，重回高增长轨道。

SEMI：预计今年全球晶圆厂设备支出增长2% 达1100亿美元

【大行评级｜中银国际：下调ASMPT目标价至98港元短期业绩无碍先进封装业务积极进展】中银国际发布研究报告指，ASMPT2024年第四季度收入达到指引区间上限，这得益于AI应用的强劲增长，但SEMI和SMT业务的利润率疲软，导致净利润仅为400万港元，调整后净利润也仅为7600万港元，均逊预期。中银国际表示，对热压焊接(TCB)和其他先进封装设备的结构性需求保持乐观，同时在产品认证和获得订单方面，ASMPT在去年第四季和今年首季均有稳步进展。该行又指，通用半导体设备和非AI相关应用目前仍是业绩拖累因素，但预计从2025年起，ASMPT的先进封装业务收入占比将超过30%，净利润贡献将超过50%，故认为目前股价被低估。该行对ASMPT今年及明年盈利预测分别下调28%及16%，将其目标价由107港元下调至98港元，认为短期业绩无碍先进封装业务积极进展，维持其评级为“买入”。

存储市场，又变天了？

【韩国最大半导体博览会开幕阿斯麦等500多家芯片企业参展介绍尖端半导体技术】国际半导体设备与材料组织（SEMI）19日表示，韩国最大半导体展览会“SEMICON KOREA”当天将在首尔江南区的韩国国际会展中心（COEX）开幕，为期三天。韩国两大芯片巨头——三星电子和SK海力士，以及美光科技、格罗方德半导体、铠侠、阿斯麦、应用材料（AMAT）、拉姆研究和东京电子（TEL）等500多家芯片企业将参展，介绍尖端半导体技术。研讨会和出口洽谈会等配套活动也将举行。应用材料、格罗方德半导体、美光科技、英飞凌和铠侠还将参加出口洽谈会，同韩企举行商务会议。

亏了5500万也要卖！这家硅料企业的股东为何都要“跑”？

【特约大V】邓声兴：外围不确定性增加影响投资者入市方向

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短期业绩无碍先进封装业务积极进展】中银国际发布研究报告指，ASMPT2024年第四季度收入达到指引区间上限，这得益于AI应用的强劲增长，但SEMI和SMT业务的利润率疲软，导致净利润仅为400万港元，调整后净利润也仅为7600万港元，均逊预期。中银国际表示，对热压焊接(TCB)和其他先进封装设备的结构性需求保持乐观，同时在产品认证和获得订单方面，ASMPT在去年第四季和今年首季均有稳步进展。 该行又指，通用半导体设备和非AI相关应用目前仍是业绩拖累因素，但预计从2025年起，ASMPT的先进封装业务收入占比将超过30%，净利润贡献将超过50%，故认为目前股价被低估。该行对ASMPT今年及明年盈利预测分别下调28%及16%，将其目标价由107港元下调至98港元，认为短期业绩无碍先进封装业务积极进展，维持其评级为“买入”。","url":"https://stock-news.laohu8.com/highlight/detail?id=2514381152","media":"金融界","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2514381152?lang=zh_cn&edition=fundamental","pubTime":"2025-02-27 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KOREA”当天将在首尔江南区的韩国国际会展中心（COEX）开幕，为期三天。韩国两大芯片巨头——三星电子和SK海力士，以及美光科技、格罗方德半导体、铠侠、阿斯麦、应用材料（AMAT）、拉姆研究和东京电子（TEL）等500多家芯片企业将参展，介绍尖端半导体技术。研讨会和出口洽谈会等配套活动也将举行。应用材料、格罗方德半导体、美光科技、英飞凌和铠侠还将参加出口洽谈会，同韩企举行商务会议。","url":"https://stock-news.laohu8.com/highlight/detail?id=2512128193","media":"金融界","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2512128193?lang=zh_cn&edition=fundamental","pubTime":"2025-02-19 13:19","pubTimestamp":1739942399,"startTime":"0","endTime":"0","summary":"国际半导体设备与材料组织（SEMI）19日表示，韩国最大半导体展览会“SEMICON 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