阿里雲全光互聯架構，突破AI算力瓶頸

科技行者

02/28

本文來自微信公衆號「電子發燒友網」，【作者】李彎彎。電子發燒友網報道（文/李彎彎）全球算力基建敘事生變，正從GPU時代邁向連接為王的通信時代。算力Scaling-law邊際效益放緩，芯片間連接通信成系統算力釋放的核心瓶頸，光互聯逐漸替代銅連接，成為構建高性能AI網絡的關鍵。近期阿里、騰訊均推出NPO（近封裝光學）重大成果，其中阿里雲全光Scale-up網絡架構UPN512通過光互連直接連接xPU與...

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(USD) INC","LU1196710864.SGD":"Schroder ISF Emerging Markets Multi-Asset A Dis SGD-H","LU0117841782.USD":"JPM GREATER CHINA \"A\" (USD) INC","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC"},"translate_title":"Alibaba Cloud's all-optical interconnection architecture breaks through the bottleneck of AI computing power","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"89988":0.6,"09988":1.95,"HBBD.SI":0.6,"ALBmain":0.6,"BABA":1.95},"content_text":"本文來自微信公眾號「電子發燒友網」，【作者】李彎彎。電子發燒友網報道（文/李彎彎）全球算力基建敍事生變，正從GPU時代邁向連接為王的通信時代。算力Scaling-law邊際效益放緩，芯片間連接通信成系統算力釋放的核心瓶頸，光互聯逐漸替代銅連接，成為構建高性能AI網絡的關鍵。近期阿里、騰訊均推出NPO（近封裝光學）重大成果，其中阿里雲全光Scale-up網絡架構UPN512通過光互連直接連接xPU與交換機，採用單層CLOS拓撲實現512顆xPU的全互聯，該方案徹底消除機櫃內高速銅纜，顯著降低佈線複雜度、散熱負擔、供電需求及運維成本，功耗降低50%，成本下降30%。近封裝光學NPO技術優勢首先我們來看看什麼是NPO及其優勢。中國移動雲能力中心此前發布過一份《雲智算光互連發展報告》，該報告介紹，NPO的核心思想是，將光引擎非常靠近電芯片放置，但並不像CPO那樣與電芯片共封裝在同一基板或中介層上。它通常將光引擎安裝在同一基板上，通過極短的高性能電氣鏈路與電芯片相連，形成一個高度集成的系統，如下圖所示。NPO將光引擎與電芯片物理分離，避免了電芯片的高温熱量直接衝擊光器件，散熱設計更簡單、高效。由於電芯片本身是巨大的熱源，工作時温度很高，而激光器等光器件對温度極其敏感，所以，光引擎與電芯片共封裝會導致波長漂移和性能下降。同時，由於光引擎未與電芯片共封裝，NPO在可維護性層面具有優勢，如果光引擎失效，只需更換光引擎子模塊即可，避免了大量的維護成本。相比激進的CPO技術，NPO技術是一種更務實、風險更低的路徑。並且，NPO與傳統光模塊相比，其性能遠超傳統光模塊，其主要優勢包括以下幾點：NPO的光引擎擁有更大的可佈置面積和更靈活的走線方案，可以方便地使用LGA封裝，且有利於光引擎散熱；NPO不影響電芯片原有設計，只對PCB或基板做差異設計即可滿足不同需求；NPO與電芯片解耦，能夠避免形成電芯片壟斷問題；NPO可單獨測試TP1的電信號質量，可歸一化設備的驅動與固件，可測試性更好。產業界正在形成共識，未來光互聯由Scale-up、Scale-out、Scale-across等多元網絡連接場景共同驅動，各技術路線長期共存、並行發展。Scale-Up即垂直擴展，通過向單個節點添加更多硬件提升處理能力。在AI大模型訓練裏，它藉助高速互聯技術將單個節點多塊GPU緊密相連，形成有超大共享顯存池的「超級節點」，讓單個模型能在統一顯存空間高效訓練，無需跨節點通信，是解決「內存牆」瓶頸的關鍵。Scale-Out是水平擴展，通過增加節點組成集群提升整體處理能力。當單個「超級節點」算力不夠時，將成百上千個節點用高速網絡連接成龐大計算集群，讓模型訓練任務可並行分佈在眾多GPU上。Scale-Across（跨區域擴展）是應對超大規模AI計算需求提出的「第三大支柱」範式。隨着AI模型對算力需求爆炸式增長，單個數據中心在電力、散熱、空間上接近極限，Scale-Across便是將不同城市、國家甚至大洲的多個數據中心用高速網絡連接，形成協同工作的「超級巨型工廠」。隨着AI大模型向千億、萬億參數規模突破，訓練與推理場景的高併發數據傳輸需求呈指數級增長，Scale up網絡作為支撐算力高效釋放的核心基礎設施，規模也在迅速擴大。目前，Scale out層面可插拔光模塊仍是首選，Scale up層面作為新興光模塊市場，技術高速迭代，NPO、CPO等方案同步演進。全球首款3.2T NPO模塊成功點亮2025年10月，阿里雲正式發布UPN512全光Scale-up架構白皮書，提出基於單層以太網光互連的全新設計，旨在打造「大規模、高性能、高可靠、低成本、易擴展」的xPU互聯繫統。UPN512通過光互連直接連接xPU與交換機，採用單層CLOS拓撲實現512顆xPU全互聯，還為擴展至1K+節點預留架構空間。此方案消除機櫃內高速銅纜，大幅降低佈線複雜度、散熱負擔、供電需求及運維成本。NPO是UPN512架構的核心使能技術。它將光電引擎靠近主芯片部署，採用線性直驅技術，省去傳統DSP芯片，實現功耗降低50%以上、成本下降30%、端到端時延與銅互連相當，且供應鏈更安全可控。與LPO相比，NPO帶寬密度更高，對主芯片SerDes性能要求更低；和CPO相比，NPO採用標準LGA連接器，保持光模塊開放解耦特性，更易被用户採納。阿里雲從3.2T NPO切入研發，基於OIF標準封裝，在22.5mm×35.1mm尺寸內實現3.2Tb/s傳輸帶寬。通過標準LGA連接器，光引擎與主芯片物理和電氣解耦，延續開放生態。該模塊支持硅光與VCSEL兩種技術路線，適配不同場景。近日，阿里雲宣佈全球首款基於OIF標準封裝的3.2T NPO模塊成功點亮，標誌着全光Scale-up進入工程落地新階段。該模塊基於兩顆16通道收發一體硅光芯片，搭配線性直驅Driver/TIA芯片，採用2D封裝工藝，具備快速量產潛力。其關鍵性能指標優異：發送端光眼圖性能好，符合IEEE 802.3bs DR4標準，可與傳統帶DSP的DR4光模塊無縫互通；接收端在1E-6誤碼率下，所有通道靈敏度優於-5dBm；典型功耗約20W，低於同帶寬DSP方案。阿里雲將3.2T NPO技術率先應用於新一代國產四芯片交換機。該設備單機集成4顆25.6T國產交換芯片，總交換容量達102.4T，可平滑演進至409.6T平台。目前，該交換機已完成整機上電與核心功能驗證，進入長期可靠性測試階段。寫在最後在算力需求持續增長的當下，全球算力基建正經歷深刻變革。算力中心多元網絡連接場景驅動光互連技術發展。從目前的情況來看，可插拔光模塊在未來幾年仍是需求主力；NPO/CPO在櫃內全光連接領域加速滲透，CPO進展超預期。此前市場對NPO較少關注，隨着近期阿里雲、騰訊在NPO方面的動作和進展，其技術優勢想必會更多的被業界關注。整體來看，光互連行業市場空間將持續擴大。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}