NVIDIA Vera Rubin NVL144服務器計劃2026年量產

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2025/10/21

據台灣經濟日報獲取的供應鏈內部文件顯示，富士康已啓動NVIDIA Vera Rubin NVL144 MGX液冷機架的工程驗證，計劃於 2026 年下半年投入大規模生產。每台NVL144設備配備144顆搭載HBM4的Rubin GPU、升級版88核Vera CPU，以及用於CPU與GPU、GPU與GPU間通信的ConnectX-9網卡和第六代NVLink互連技術，其計算密度較當前的NVL72平台...

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NVL144 MGX液冷機架的工程驗證，計劃於 2026 年下半年投入大規模生產。每台NVL144設備配備144顆搭載HBM4的Rubin GPU、升級版88核Vera CPU，以及用於CPU與GPU、GPU與GPU間通信的ConnectX-9網卡和第六代NVLink互連技術，其計算密度較當前的NVL72平台實現了翻倍。中國台灣代工廠商富士康目前承擔着英偉達約60%的AI服務器產能，且正擴建其位於美國威斯康星州和休斯頓工廠的浸沒式冷卻與鍍銅生產線，以滿足新的本土製造要求。GB300芯片的峯值出貨期與Rubin芯片的首次量產間隔將為6至8個月，這是英偉達史上代際間隔最短的一次。儘管產品路線圖有所加速，但在2026年年中之前，Blackwell Ultra仍將是英偉達的主要收入來源。採購數據顯示，雲服務提供商已預訂約40萬個GB300節點，將於2025年底至2026年初交付，這表明短期需求依然強勁。與此同時，OpenAI已向Vera Rubin芯片下了大額預訂單，鎖定了初期產能，也為富士康的產能投資提供了支持。在30個月內從Hopper架構快速過渡到Blackwell架構，再到Rubin架構，標誌着數據中心設備周期進入了最快加速階段，這也迫使超大規模數據中心運營商加快了設備折舊進度。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"}}}