美股详情

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台积电

237.56

+0.61000.26%

盘后：238.200.6400+0.27%19:59 EDT

成交量：1,509.26万

成交额：35.69亿

市值：1.23万亿

市盈率：31.31

高：238.31

开：236.40

低：234.15

收：236.95

数据加载中...

总览公司新闻公告

美拟扩大半导体税收减免，台积电、环球晶、三星等有望受惠

半导体三强进击面板级封装引爆新一波抢单大战

海纳国际集团：维持台积电(TSM.US)评级，由Positive调整至Positive评级, 目标价由250.00美元调整至255.00美元。

三巨头竞逐面板级封装

半导体芯闻

这一领域芯片，重度依赖台积电

半导体产业纵横

台积电5月份营收出炉苹果机皇价比百元机果粉心碎！

中关村在线

曝台积电2nm良品率高达60% 将主导下一代芯片市场

台积电和三星电子计划今年下半年开始大规模生产2纳米半导体技术

【产业信息速递】这一关键材料，或将对芯片供应造成威胁

北京半导体行业...

【产业信息速递】HBM4，变贵了

北京半导体行业...

台积电美厂首批晶圆出炉，先进封装仍倚重台湾

中关村在线

三星被甩开！台积电2nm良率破60%：苹果NV都是客户

特朗普税改法案将半导体税收抵免提高至30%

台积电盘中异动早盘大幅拉升3.03%

2025年圆晶行业现状分析：中国大陆圆晶代工市场规模达到1026亿元

苹果A20芯片首发2nm工艺 iPhone 18 Pro和折叠屏独占

【产业信息速递】跃居全球最大封装厂，台积电要颠覆电源

北京半导体行业...

【每周海外精选】三星与英伟达将投资 Skild AI、高通宣布收购Autotalks

通信世界网

【台股收跌0.1%】台湾加权指数收盘下跌23.05点，跌幅0.1%，报22049.9点。台积电(2330.TW)收跌0.49%报1025元新台币。

ASML EUV光刻之路还能走多远？

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苹果机皇价比百元机果粉心碎！","url":"https://stock-news.laohu8.com/highlight/detail?id=2544696574","media":"中关村在线","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2544696574?lang=zh_cn&edition=fundamental","pubTime":"2025-06-17 16:58","pubTimestamp":1750150711,"startTime":"0","endTime":"0","summary":"从台积电在官网披露的数据来看，他们在5月份营收3205.16亿新台币，高于去年同期的2296.2亿，同比大增39.6%，不及4月份的3495.67亿，环比下滑8.3%。随着5月份同比大增39.6%，台积电的月度营收就已连续17个月同比增长，上一次同比下滑还是2023年的12月份，那一个月营收1763亿新台币，同比下滑8.4%。5月份同比大增39.6%，台积电前今年5个月的营收，就均保持了30%以上的同比增长率，在此前的4个月，他们的营收是同比分别增长35.9%、43.1%、46.5%和48.1%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061718033395200a09&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, 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正加快步伐向2nm芯片时代迈进。近年来，台积电凭借从5nm到3nm制程的技术领先优势，稳坐全球晶圆代工龙头地位。此次2nm制程的突破，被认为是台积电未来数年营收成长的关键动能。目前三星虽表示其2nm制程也在逐步提升良率，但短期内仍难以撼动台积电的领先优势。整体来看，台积电凭借更高的良率、更稳定的制程与强大的客户信任，极可能在2nm世代继续巩固其全球芯片市场的霸主地位，也将进一步拉大与竞争对手之间的技术差距。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250617151753a4adbe38&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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13:58","pubTimestamp":1750139883,"startTime":"0","endTime":"0","summary":"业内人士指出，SK海力士、三星电子等企业难以将增加的HBM成本完全转嫁给客户。不过，尽管I/O数量增加，三星电子HBM4核心裸晶的单位晶圆产出量预计将略有上升。尽管单位晶圆芯片数有所改善，三星的HBM4制造成本仍可能高于竞争对手。因此，业界预测HBM4的12层堆叠产品价格将超过600美元。存储厂商选择通过晶圆代工来生产HBM4基础裸晶，是为了满足HBM不断提升的性能需求。未来，基础裸晶的重要性预计将进一步上升。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250617140513a4ad9fa1&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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10:49","pubTimestamp":1750128540,"startTime":"0","endTime":"0","summary":"快科技6月17日消息，在芯片代工领域，台积电一直占据着领先地位，据最新报道，台积电的2nm工艺良率已经突破60%。相比之下，三星的2nm工艺良率目前仅为40%，尽管三星也在不断努力追赶，但台积电的领先优势依然明显。据报道，台积电的2nm客户主要是3nm客户的延续，苹果、NVIDIA、AMD、高通和联发科等公司都将是台积电2nm工艺的首批客户。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/t/2025-06-17/doc-infaiwtp6833528.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"三星被甩开！台积电2nm良率破60%：苹果NV都是客户","news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["LU2089283258.USD","LU0528227936.USD","LU0889565833.HKD","BK4533","BK4503","BK4554","IE00B19Z9505.USD","03145","LU2213496289.HKD","BK4573","LU0572939691.SGD","LU2505996681.GBP","IE00BBT3K403.USD","LU0456855351.SGD","LU1814569148.SGD","LU0354030438.USD","TWmain","IE00BSNM7G36.USD","EWT","IE00BKDWB100.SGD","LU1244550221.USD","MACW.SI","LU1839511570.USD","BK4605","LU2168564065.EUR","LU2054465674.USD","LU2360032135.SGD","TSM","LU1935043023.USD","LU0096362180.USD","LU0265550359.USD","LU0784384876.USD","LU0882574139.USD","LU2247934214.USD","LU2750360997.AUD","LU2461242641.AUD","LU2543165471.USD","LU2602419157.SGD","LU0466842654.USD","LU2361044949.HKD","LU0314106906.USD","LU0154236417.USD","LU0949170426.SGD","IE00BJTD4N35.SGD","SG9999014567.USD","LU1989771016.USD","LU0198837287.USD","LU1674673428.USD","LU1815333072.USD"],"gpt_icon":1},{"id":"2544989234","title":"特朗普税改法案将半导体税收抵免提高至30%","url":"https://stock-news.laohu8.com/highlight/detail?id=2544989234","media":"爱集微","labels":["policyRegulatory"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2544989234?lang=zh_cn&edition=fundamental","pubTime":"2025-06-17 07:31","pubTimestamp":1750116673,"startTime":"0","endTime":"0","summary":"据报道，美国参议院的税收法案草案要求暂时增加对半导体制造商的投资抵免，加强对芯片制造商在美国建厂的补贴。该措施将把税收抵免额度从工厂投资的25%提高到 30%，从而进一步激励芯片制造商在2026年底税收减免到期之前投资建设新工厂。特朗普呼吁废除《芯片法案》，但两党议员都不愿取消为其选区提供高薪工作的补贴。参议员们希望在7月4日假期前将这项旨在为家庭和企业减税数万亿美元的税收法案送达特朗普的办公桌。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250617073826978279d6&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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早盘大幅拉升3.03%","url":"https://stock-news.laohu8.com/highlight/detail?id=2543360636","media":"市场透视","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2543360636?lang=zh_cn&edition=fundamental","pubTime":"2025-06-16 22:35","pubTimestamp":1750084524,"startTime":"0","endTime":"0","summary":"北京时间2025年06月16日22时35分，台积电股票出现异动，股价急速拉升3.03%。台积电股票所在的半导体行业中，整体涨幅为2.22%。台积电公司简介：台湾积体电路制造股份有限公司是全球最大的专用芯片代工企业，按Gartner计算，2020年其市场份额超过58%。台积电成立于1987年。台积电的规模和高质量的技术使该公司即使在竞争激烈的代工业务中也能产生稳定的营业利润。此外，向无晶圆厂商业模式的转变也为台积电创造了有利条件。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250616223525a70c4ee2&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, 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17:37","pubTimestamp":1750066626,"startTime":"0","endTime":"0","summary":"2025年，圆晶行业在全球经济、技术创新以及市场需求等多重因素的交织影响下，展现出了独特的发展态势。2024年全球晶圆代工市场规模将达到1513亿美元，预计2025年达到1698亿美元。2023年中国大陆晶圆代工市场规模约为 852 亿元，较上年增长 10.51%。2025年圆晶行业在产能、市场和技术方面呈现出复杂而多元的发展态势。更多圆晶行业研究分析，详见中国报告大厅《圆晶行业报告汇总》。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506161759359781b63e&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Max以及传闻中的iPhone 18 Fold折叠机将成为A20芯片与WMCM封装的首发机型。值得注意的是，目前消息并未提及iPhone 18与iPhone 18 Plus等非Pro机型是否也会采用WMCM封装。考虑到成本控制与产品定位，苹果或许会继续在标准款上使用旧版InFo封装，以拉开与Pro系列的差异。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061615011897817d4d&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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14:21","pubTimestamp":1750054919,"startTime":"0","endTime":"0","summary":"伯恩斯坦证券预测，随着AI芯片用CoWoS需求的爆发，台积电今年先进封装营收有望占总营收的10%，超越日月光，成为全球最大封装供应商。此外，上个月的台积电2025技术研讨会首次披露了CoWoS技术的下一步发展，这将引发一场新的技术革命和激烈的跨行业竞争。本次台积电2025技术研讨会首次亮相的嘉宾，台达电源与系统事业群总经理陈盈源，进行了进一步的讲解。正因如此，一位业内高管透露，英飞凌的高性能电源IC已经不再卖给台达了。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250616143202a4ab718d&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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