AMD 首次公开静态展示下代机架级 AI 系统“Helios”，预计 2026 年批量部署

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10/15

IT之家 10 月 15 日消息，AMD 在美国加州举行的 2025 OCP 全球峰会上首次公开静态展示了其首个专为前沿 AI 工作负载设计的机架系统参考设计 "Helios"。"Helios" 系统采用 Meta 在本次会议上推出的 ORW“双宽”机架规范，这一形态针对下一代 AI 系统的电源、冷却和可维护性需求进行了优化。标准化加速了 "Helios" 系统的上市、部署、投运，也支持 OEM ...

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系统的上市、部署、投运，也支持 OEM ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015093638a46077d6&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4605","symbol_name":"半导体精选","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015093638a46077d6&s=b","article_id":"2575322725","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015093638a46077d6&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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年实现批量部署。广告声明：文内含有的对外跳转链接（包括不限于超链接、二维码、口令等形式），用于传递更多信息，节省甄选时间，结果仅供参考，IT之家所有文章均包含本声明。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}